Tesa 8410

Product Description tesa® HAF 8410 is a heat-activatable film based on nitrile rubber and phenolic resin, and is covered with a paper liner. The material is non-adhesive at room temperature, making it easy to cut and punch. The process temperature for pre-fixing is approximately 90°C. In a second processing step, the product is applied under heat and pressure. After full curing, tesa® HAF 8410 achieves extremely high bond strength as well as excellent temperature and chemical resistance. The adhesive joint remains elastic. Main Applications tesa® HAF is specifically designed for the implementation of chip modules in smart cards. Additionally, the product is suitable for bonding temperature-resistant materials such as:MetalGlassPlasticWood and textiles Technical PropertiesLiner TypeRelease paperThickness60 µmAdhesiveNitrile rubber & phenolic resinColorAmberCarrier MaterialNonePeel Strength12N/cm²Dynamic Shear Strength12N/cm² Processing Pre-lamination tesa® HAF becomes tacky between approximately 90°C and 110°C. Curing Bonding parameters—temperature, pressure, and time—depend on the application and the materials being bonded. As a guideline: Splicing Applications: Temperature: 120°C - 200°C Pressure: > 2 bar Time: 15 sec. - 30 min. Bonding of Clutch Linings: Temperature: 180°C - 230°C Pressure: > 6 bar Time: 1 min - 30 min. For maximum bond strength, surfaces should be clean and dry. Storage Conditions In accordance with tesa® HAF durability concept. Larger quantities are available upon request.