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Tesa® HAF 8410 60µm reactive heat-activated film

Product information "Tesa® HAF 8410 60µm reactive heat-activated film"

Product Description

tesa® HAF 8410 is a heat-activatable film based on nitrile rubber and phenolic resin, and is covered with a paper liner.

The material is non-adhesive at room temperature, making it easy to cut and punch. The process temperature for pre-fixing is approximately 90°C. In a second processing step, the product is applied under heat and pressure.

After full curing, tesa® HAF 8410 achieves extremely high bond strength as well as excellent temperature and chemical resistance. The adhesive joint remains elastic.

Main Applications

tesa® HAF is specifically designed for the implementation of chip modules in smart cards.
Additionally, the product is suitable for bonding temperature-resistant materials such as:

  • Metal
  • Glass
  • Plastic
  • Wood and textiles

Technical Properties

Liner Type
Release paper
Thickness60 µm
AdhesiveNitrile rubber & phenolic resin
ColorAmber
Carrier MaterialNone
Peel Strength12N/cm²
Dynamic Shear Strength12N/cm²

Processing

  1. Pre-lamination
    tesa® HAF becomes tacky between approximately 90°C and 110°C.

  2. Curing
    Bonding parameters—temperature, pressure, and time—depend on the application and the materials being bonded. As a guideline:

    • Splicing Applications:

      • Temperature: 120°C - 200°C

      • Pressure: > 2 bar

      • Time: 15 sec. - 30 min.

    • Bonding of Clutch Linings:

      • Temperature: 180°C - 230°C

      • Pressure: > 6 bar

      • Time: 1 min - 30 min.

For maximum bond strength, surfaces should be clean and dry.

Storage Conditions In accordance with tesa® HAF durability concept.

Larger quantities are available upon request.

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